Specification Comparison
| Main unit | |||||
|---|---|---|---|---|---|
| Model | VMR-H3030 / H3030 Z120X | VMR-3020 / 3020 Z120X | VMR-6555 / 6555 Z120X | VMR-10080 / 10080 Z120X | |
| Stroke (XxYxZ) | 300 x 300 x 150 mm (11.8 x 11.8 x 5.9 in.) |
300 x 200 x 150 mm (11.8 x 7.9 x 5.9 in.) |
650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.) |
1000 x 800 x 150 mm (39.4 x 31.5 x 5.9 in.) |
|
| Optical head for type 1, 2, 3 | |||||
| With max. magnification module (high mag. lens) | 300 x 300 x 150 mm (11.8 x 11.8 x 5.9 in.) |
300 x 200 x 150 mm (11.8 x 7.9 x 5.9 in.) |
650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.) |
1000 x 800 x 150 mm (39.4 x 31.5 x 5.9 in.) |
|
| With max. magnification module (low mag. lens) | 250 x 300 x 150 mm (9.8 x 11.8 x 5.9 in.) |
250 x 200 x 150 mm (9.8 x 7.9 x 5.9 in.) |
600 x 550 x 150 mm (23.6 x 21.7 x 5.9 in.) |
950 x 800 x 150 mm (37.4 x 31.5 x 5.9 in.) |
|
| Minimum readout | 0.01µm | 0.1µm | |||
| Maximum workpiece weight | 30kg (66.1 lb) | 20kg (44.0 lb) | 30kg (66.1 lb) | 40kg (88.2 lb) | |
| Measuring accuracy | |||||
| U1X, U1Y | 0.6 + 2L/1000µm (with a workpiece max. 10kg) |
1.5 + 4L/1000µm (with a workpiece max. 5kg) |
1.5 + 2.5L/1000µm (with a workpiece max. 30kg) |
2 + 4L/1000µm (with a workpiece max. 40kg) |
|
| U2XY | 0.9 + 3L/1000µm (with a workpiece max. 10kg) |
2.5 + 4L/1000µm (with a workpiece max. 5kg) |
2.5 + 2.5L/1000µm (with a workpiece max. 30kg) |
3 + 4L/1000µm (with a workpiece max. 40kg) |
|
| Z-axis (L: length in mm < W.D.) | 0.9 + L/150µm | 1.5 + L/150µm | |||
| Camera | B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD | ||||
| Working distance | |||||
| Optical head for type 1, 2, 3 |
50mm |
||||
| With max. magnification module | High mag. objective lens: 9.8mm Low mag. objective lens: 32mm |
||||
| Magnification vs field of view | |||||
| Optical head for type 1 | 0.5 - 7.5X / 9.33 x 7 - 0.622 x 0.467 mm | ||||
| Optical head for type 2 | 1 - 15X / 4.67 x 3.5 - 0.311 x 0.233 mm | ||||
| Optical head for type 3 | 2 - 30X / 2.33 x 1.75 - 0.155 x 0.117 mm | ||||
| With max. magnification module | 1 - 120X / 4.67 x 3.5 - 0.039 x 0.029 mm | ||||
| Auto focus | TTL Laser AF and Vision AF | ||||
| Illumination | |||||
| Optical head for type 1, 2, 3 | Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring) | ||||
| With max. magnification module | Episcopic, diascopic (with high mag. head only), darkfield illumination | ||||
| Power source | AC100-240V±10%, 50/60Hz | ||||
| Power consumption | Max. 11A (standard type), 13A (Z120X. type) |
Max. 13A (standard type), 15A (Z120X. type) | |||
| Dimensions & weight | |||||
| Main unit only | 915 x 1060 x 1300 mm, approx. 450kg (36.0 x 41.7 x 51.2 in., 992.1 lb.) |
625 x 728 x 1195 mm, approx. 200kg (24.6 x 28.7 x 47.0 in., 441.0 lb.) |
- | - | |
| Main unit & table | 1000 x 1100 x 1900 mm, approx. 570kg (39.4 x 43.3 x 74.8 in., 1256.6 lb.) |
690 x 730 x 1725 mm, approx. 240kg (27.2 x 28.7 x 67.9 in., 529.1 lb.) |
1220 x 1680 x 1750 mm, approx. 600kg (48.0 x 66.1 x 68.9 in., 1322.8 lb.) | 1530 x 2200 x 1750 mm, approx. 1500kg (60.2 x 86.6 x 68.9 in., 3306.9 lb.) | |
| Controller | 250 (W) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.) | ||||
| Foot print | 2400 (W) x 1400 (D) mm (94.5 x 55.1 in.) | 2100 (W) x 1100 (D) mm (82.7 x 43.3 in.) | 2400 (W) x 2000 (D) mm (94.5 x 78.7 in.) | 2800 (W) x 2500 (D) mm (110.2 x 98.4 in.) | |
| Host Computer | |||||
| Main unit | IBM PC/AT (Windows® XP) | ||||
| Monitor | 20-in. TFT color | ||||
- *The "Z120X" type is equivalent to the "TZ" type in Japan.
| Automated wafer measuring system VMR3020 + NWL860T | ||
|---|---|---|
| Compatible wafer sizes | ø150mm/200mm (SEMI/JEIDA compliant, silicon) | |
| Standard wafer carriers | Entegris® 150mm: PA182-60MB, 200mm: 192-80M | |
| Processing speed per carrier (continuous transfer of 25 wafers) |
8 minutes + NEXIV's measurement time | |
| Orientation flat/notch detection | Non-contact, transmitted-type sensor | |
| Wafer transfer/chuck | Vacuum chuck, mechanical transfer | |
| Main unit dimensions (excluding PC rack) | 1700 (W) x 960 (D) x 1735 (H) mm (66.9 x 37.8 x 68.3 in.) | |
| Footprint (excluding areas for operation and maintenance) | 2750 (W) x 1100 (D) mm (108.3 x 43.3 in.) | |
| Main unit weight | Approx. 370kg (815.7 lb.) | |
| Requirements | Electricity | AC100-240V±10%, 50/60Hz, 11.5A max. |
| Vacuum | -800hPa (-600mmHg), 10NI/min. | |
| Wafer carrier measuring system NEXIV VMR-C4540 | ||
|---|---|---|
| Compatible carriers (FOUP, FOSB, OC) |
SEMI-compliant ø300mm wafer carriers 200mm wafer carriers (with dedicated adapter) |
|
| Stroke | Measuring head (X x Y x Z) | 480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.) |
| Rotary table | 360° (in 90° increments) | |
| Minimum readout | 0.1µm | |
| Head travel speed | XZ axis: max. 200mm/s (7.9 in.) Y axis: max. 50mm/s (2.0 in.) |
|
| Kinematic plate rotation speed | 90°/2 sec. | |
| Camera | B&W 1/2-in. CCD | |
| Optical magnification | 0.27X to 2.74X (5-step 10X zoom) | |
| Field of view | 20 x 16 mm to 2.0 x 1.6 mm | |
| Max. workpiece weight | 15kg (33.1 lb.) | |
| Measuring accuracy | 10 + 10L/1000µm (L: measuring length in mm) | |
| Repeatability (2σ) | 2µm | |
| Illumination | Episcopic, diascopic, darkfield | |
| Auto focus | Laser AF, Vision AF | |
| Power source | AC100-240V±10%, 50/60Hz | |
| Power consumption (approx.) | AC100-120V: 13A (main unit), 9A (PC) AC200-240V: 7A (main unit), 5A (PC) |
|
| Dimensions | 1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.) | |
| Weight | Approx. 1400kg (3086.41 lb.) | |
| Host computer | IBM PC/AT (Windows® XP) | |
| Monitor | 19-in. TFT | |