XT V 160 Electronics X-ray Inspection
Top-class inspection system for miniaturized electronic components
Component connections on today’s compact and densely populated PCBs are hidden by other components, making X-ray the only viable inspection solution. XT V 160 is an easy-to-use, cost-effective and high-quality PCB inspection system targeting production facilities and failure analysis laboratories.
In automated inspection mode, samples can be inspected at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies.
Features
- NanoTechTM source with submicron focal spot size
- Fast data capture and high-quality imaging
- Large tray for loading multiple boards
- Customizable macros automate measurement workflow
- Remote validation station available
Applications
- Solder reflow analysis
- BGA connectivity and analysis
- Solder void calculation
- Through hole measurement and inspection
- Die attach voiding measurement
- Ball bond analysis
- Stitch bond analysis
- Micro BGA / chip on chop analysis
- Pad array analysis
- Dry joint detection and analysis
Benefits
- Flexibility combined in one system
- Interactive visualization
- Fully automatic X-ray inspection
- Optional CT for in-depth analysis
- Fast operation with intuitive GUI and interactive joystick navigation
- Low-cost maintenance with open-tube technology
- Safe system requiring no special precautions or badges
- Small footprint
